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PAPER PUBLISHED

February, 2025

恭喜本實驗室研究生 唐睿甫 鄭家承與林煒淳教授,攜手中央大學洪緯璿教授共同進行研究取得豐碩成果,成功改善樹脂後固化時的嚴重收縮問題,發表於國際期刊 Materials Advances。

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Wei-Chun Lab has expertise in organic electronics, characterization, and applications.
We are inspired to investigate the degradation mechanism of materials and devices combining surface analysis and sputtering techniques. Group members come from a diversity of backgrounds and better their laboratory, communication, and presentation skills.
Our current research centers on photovoltaics (OPV, Perovskite), additive manufacturing (3D printing), and surface analysis (XPS, ToF-SIMS, AES).
Our work is enhanced by collaborations with researchers across diverse science and engineering fields (chemical engineering, materials science, chemistry, biomedical engineering, etc.)

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中山大學電資大樓四樓EC4017(萊爾富前)

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